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  CEMOP - Center of Excellence in Microelectronics Optoelectronics and Processes Last modified: 16 June 2003.
 
Research & Development
  List of All International Projects
In Activity
Already Concluded
 

List of All National Projects
In Activity
Already Concluded

  Start up projects that gave rise to the appearance of CEMOP
National research projects in activity

I- Industry oriented projects

“Optical inspection cameras using 1024 arrays of linear psd-SENSIT”
POE, B3, 3.1 (2002/2005), ref. 03/00197.
Duration: 3 years
Partners: UNINOVA/CEMOP, CENIMAT, Tekelec.
Responsible: R. Martins (coordinator)

The aim of this project is to develop an optical inspection camera able to perform 3-D pattern recognition on real time based on laser triangulation and analogue detection principles.


“Development of an IR detector based on c-Si-IRS”
POE, B3, 3.1 (2002/2005), ref. 03/00198.
Partners: UNINOVA/CEMOP, CENIMAT, CSP.
Duration: 3 years
Responsible: E. Fortunato (coordinator)

The aim of this project is to develop IR detectors based on c-Si able to be integrated in surveillance system at a very low cost. Apart from that, it is also intention to develop the processes that allow CEMOP to satisfy SME requirements concerning the production of hybrid electronics, based on c-Si technologies for electronic and other microelectronic applications.


“Solid State Time Meters - METES”
POSI/6250- Invest. In consortium 2002/2005.
Partners: Tekelec, CENIMAT and UNINOVA/CEMOP.
Duration: 3 years
Responsible: E. Fortunato (coordinator).

This project aims to develop a solid-state timer able to monitor the lifetime of a device or equipment with which it is connected. The device to be developed is based in the detection and accumulation charge principle on structures, able to satisfy the following requirements: ecological compatible and measurements vibration’s and temperature independent (solid state); to allow the visualization of the lifetime of the device with and without energy applied; able to restore the initial state; precision better than 5% over the full scale of the device; to have an alarm indicating the end of life; costs below 2 Euros.


“Position inspection systems based on linear integrated arrays- POSINSPEC”
POCTI/6207 Invest. In consortium 2002/2005.
Duration: 3 years
Partners: Tekelec, CENIMAT, UNINOVA/CEMOP.
Responsible: R. Martins and F. Soares
This project aims to implement and to produce linear integrated position arrays from 256 to 1024 lines, up to now never produced. By doing so we expect to improve the control and inspection of products in real time in more than 70% (full and not sampling quality control), highly important for Tekelec and other companies dealing with operations related to in-line production and assembling of components. This will also open new fields of operation for Tekelec.


II- Fundamental and applied projects

“An one-step electropolimerisation of polypyrrole on metallic oxidizables surfaces in aqueous solution”
POCTI/CTM/ /2003.
Duration: 3 years
Partners: FEUP, CENIMAT, IST.
Responsible: I. Ferreira and E. Fortunato
The aim of this project is to establish two main routes concerning the use of polypyrrotic films as hard coatings or cheap gas sensors for the food industry, based on a new process to obtain polypyrrolitic homogeneous and adherent coatings by electropolymerisation, using an aqueous or hydroalcoholic solution containing pyrrole and other pyrrole derivates.


“Intelligent colour sensors based on new types of pin and MIS stacked silicon based structures”
POCTI/CTM/37344/2002.
Duration: 3 years
Partners: CENIMAT e UNINOVA/CEMOP.
Responsible: I. Ferreira (coordinator)

The aim of this project is to develop a new type of tandem MIS and pinnip graded structures based on polymorphous Si deposited on TCO coated glass substrates or on c-Si patterned wafers for colour sensor applications with 2 or 3 terminals, aiming to improve the response frequencies (>100KHz) around the virtual human eye and to improve the colour separation resolution and the threshold bias used, either for 2 or 3 accessible terminals.


“Transparent and conductive oxides for optoelectronic and gas sensor applications”
POCTI/CTM/38924/2001.
Partners: CENIMAT e CEMOP.
Responsible: E. Fortunato (coordinator).

The scope of this project is to produce and to develop transparent conductive oxide (TCO) layers for optoelectronic and gas sensor applications, reliable and have low cost, mainly for the new emergent flexible electronic applications. That is, the deposition process has to be taken place at temperatures below 100ºC, not compatible with the existing process methods that require substrate temperatures above 200ºC.


“New amorphous silicon based materials used in novel flexible position sensors”
FCT, PCTI/1999/CTM/35440.
Partners: CENIMAT and CEMOP.
Duration: 11/201 a 07/204
Responsible: E. Fortunato (coordinator).

The main objective of this project is to develop a new flexible large area a-Si:H PSD based on pin, MIS or heterostructures of thin film silicon and its alloys, satisfying the following requirements: active area >10mm×40mm; radius of curvature >14mm; spectral response optimised for 600-670nm; linearity >99%; response time <100?s; resolution <10?m; S/N ratio >7dB.


“A new flexible position angular sensor to be integrated in micromechanical devices”
FCT, PCTI/1999/ESE/35578
Partners: CENIMAT, CEMOP.
Duration: 11/201 at 06/204
Responsible: E. Fortunato (coordinator).

The aim of this project is to develop flexible position sensitive detectors for angular control of micro motors and other micromanipulation applications, with a position precision better than 1 micrometer, a response time better than 5 ms and highly reliable.


“New technologies to process thin film solar cells - UNISOL”
PRAXIS/C/CTM/12094/1998,
Duration: 1999/2003.
Partners: CENIMAT e UNINOVA/CEMOP.
Responsible: R. Martins (coordinator).

The aim of this project is to develop a new technology to process thin film silicon semiconductors for optoelectronic device applications such as solar cells. The main emphasis consists in combining the plasma enhanced chemical vapour technology with the hot wire process, aiming to produce nanocrystalline and polycrystalline silicon thin films with the required optoelectronic performances.

 
 

 
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